Thin Film Metallization

MARUWA has implemented manufacturing from the material and metallization processes by combining both technologies which were cultivated in-house for many years. The materials permit the production of sophisticated circuit patterns that meet customers’ needs with high-degree integration and electric properties by using substrates which have excellent thermal conductivity, such as alumina substrates, aluminum nitride substrates, multilayered substrates, or dielectric ceramics.

Metallization Types

List of Products



Applied circuit substrates for optical communication markets, circuit substrates for high frequency markets

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