Ceramics

Aluminum Nitride (AlN) Components

Aluminum Nitride (AlN) Components

Features


Aluminum Nitride (AlN) Components

With high thermal conductivity, high wear and corrosion resistance, Aluminum Nitride (AlN) is the most ideal material for the semiconductor and medical industries. Typical applications include: heaters, electrostatic chucks, susceptors, clamp rings, cover plates and MRI equipment. Based on a depth of material engineering and development, MARUWA offers a wide range of technical capabilities and dependable mass-production capacity to meet customer’s requirements in the most advanced fields of semiconductor and medical applications.

  • High thermal conductivity as high as metallic aluminum,7 times higher than aluminum oxide (Al2O3)

  • Similar coefficient of thermal expansion to that of silicon (Si)

  • High electric insulation

  • Highly resistant to plasma under fluorine-based gas atmosphere

  • Highly dense and fine-grained structure

  • A variety of materials suitable for different purposes(High thermal conductivity type/High purity type)

  • Sizes suitable for semiconductor manufacturing equipment

Applications


Semiconductor manufacturing equipment (heaters, electrostatic chucks, susceptors, clamps rings, cover plates) and medical equipment

Material properties


Item Material AlN
HAN-170 HAN-90
Density g/㎤ 3.3 3.2
Mechanical Characteristic Flexual Strength MPa >350 >320
Young's Modulus GPa 320 320
Thermal Characteristic Specific Heat at RT J/(㎏・K) 740 730
Thermal Expansion ~800°C 10-6/K 5 5
Thermal Conductivity W/(m・K) 170 90
Electrical Characteristic Dielectric Constant 1MHz - 9 9
Dielectric Loss 1MHz 10-4 5 4
Volume Resistivity 25°C Ω・㎝ >1014 >1012
Dielectric Breakdown Voltage ㎸/㎜ >15 >15
Application Heater,Heatsink Susceptor,Ring

Standard size


φ180~380mm × 1~10mmt  (φ550 will be available soon)
※Custom sizes are also available.

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