Thin Film Metallized Substrates
Features
Submounts have been developed by combining metallization and ceramic material technologies which MARUWA has cultivated for many years. The materials can be customized with various pattern technologies, such as wraparound metallization. This product is used in circuit substrates for optical storage, optical communication, RF application, and various other uses.
Applications
Applied circuit substrates for optical communication markets, circuit substrates for high frequency markets
Metallization General Specification
| Item | Standard Specification | ||
| Substrate Material | Material | Alumina(Al2O3) | 99.5％、96％etc. |
| Aluminum Nitride(AlN) | - | ||
| Dielectric Substrate | ε38、ε93etc. | ||
| Thickness | 0.1㎜~1.5㎜ / 4mil~60mil | ||
| Work Size | 50.8㎜□(2inch□)、2inch × 4inch□、3inch | ||
| Film Specification (Conductor) | Film Composition / Film Thickness | Dry Etching | Ti/Pt/Au=0.06/0.2/0.3㎛~2.0㎛approx |
| Ti/Pd/Au=0.06/0.2/2.0㎛~10.0㎛approx | |||
| Wet Etching | Ti/Pd/Au=0.06/0.2/2.0㎛~10.0㎛approx | ||
| Film Specification (Resistance Body) | Seat Resistance | 25Ω/□、50Ω/□(±20%) | Special Specification (±5%) |
| T.C.R | -50±50ppm/°C | ||
| Film Composition | Tantalum Nitride(Ta2N) | ||
| Film Specification (Solder) | Film Composition / Film Thickness | Au/Sn | 1.5㎛~10㎛ |
| Processing Specification (Thin Film Circuit) | Minimum Line & Space | Dry Etching | L/S≧10㎛ |
| Wet Etching | L/S:20㎛/20㎛±10㎛ | ||
| Processing Specification (Machining) | Cutting Accuracy | ±50㎛ | |
| Item | Inspection Item | Measurement Inspection Machines |
| Quality Assurance | Size | Measuring Microscope |
| Film Thickness | X-ray Fluorscence, Surface Rough Meter | |
| Resistance | Digital Multi Meter | |
| Externals | Microscope | |
| Wire Strength | Pltester |
Standard Specification
| Item | Minimum Size | |
| A Conducter Size | 0.01㎜ | |
| B Pattern Interval | 0.01㎜ | |
| C Resistance Body Size (Thickness) | 0.05㎜ | |
| D Resistance Body Size (Length) | 0.05㎜ | |
| E Substance Thickness - Pattern Interval | 0.05㎜ | |
| F Pattern - Hole Interval | 0.1㎜ | |
| G Via Hole - Pattern Interval | 0.1㎜ | |
| H Via Hole | 1.5t㎜(t=Sbstrate Thickness) | |
| I Via Hole Interval | 0.25㎜ | |
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