Thick Film Substrates & Packages (Screen Printing)

Thick Film Substrates & Packages (Screen Printing)


Thick Film Substrates(Screen Printing)

Thick film printed and high temperature sintered substrates using excellent thermal conductivity materials, Alumina and Aluminum Nitride (AlN).
Electrode formed ceramic substrates can be miniatuarized and multifunctional.
VIA structure can connect between top and bottom surfaces.

Structure sample (cross-section)



Sensor Packages, surface-mount packages, MEMS packages, Optical communication packages, LED packages, etc

Standard specification for Thick Film Metallization (screen printing)

Item Material
Substrate Al2O3(92%) AlN
Structure Single layer icon icon Multilayered substrate Single layer icon icon Multilayered substrate
Metallized VIA Mo / W / Cu / Ag Mo / W W / Cu W
Inner layer W W
Surface layer W / Cu / Ag W / Cu / Ag Cu (Plating specification can be applied) W / Cu
Plating NiB / NiP-Au / NiP-Pd-Au(Electroless plating) / Ni-Au(Electrolytic plating)

Substrate characteristics

Item Unit Material
Al2O3(92%) AlN
Color - White Brown Gray
Bulk density g/㎤ 3.60 3.80 3.30
Mechanical characteristics Bending strength MPa >350 >350 >350
Thermal characteristics Coefficient of thermal expansion ppm/℃ 7.0 7.3 4.6
Thermal conductivity W/(m・K) 16 15 170
Electrical characteristics Dielectric constant 1GHz - 9.0 9.9 8.8
Volume resistivity 100Vdc Ω・㎝ >1014 >1014 >1014
Breakdown strength ㎸/100㎛ >10 >10 20
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