Ceramics

Aluminum Nitride (AlN) Filler

Aluminum Nitride (AlN) Filler

MARUWA aluminum nitride (AlN) filler is a thermal conductive ceramic filler developed from the technology of ceramic substrate. To fully draw the intrinsic characteristic of aluminum nitride (AlN) with high thermal conductivity and electrical insulation, only high-quality material is used for production. Our filler helps to improve characteristics at stability and heat dissipation of resin products. Applications using our aluminum nitride (AlN) filler : laminated board, thermal interface materials (TIMs) such as thermal grease, thermal pad, and encapsulant.

ANF-A Series

  • Narrow distribution curve

  • Isotropic shape

  • High purity

  • ANF-A Series
  • ANF-A Series

ANF-S Series

  • Sphere shape

  • Narrow distribution curve

  • High loading capacity

  • High thermal conductivity (7 times higher than aluminum oxide (Al2O3))

  • High electrical insulation

  • ANF-A Series
  • ANF-A Series
  • ANF-A Series
Unit A-Series S-Series
A-01-F A-05-F S-30 S-50 S80
Bulk Density g/㎤ 0.36 0.66 1.50 1.65 1.65
Thermal Conductivity W/mK 180 ~ 200
Electrical Insulation Ω/㎝ >1014
Thermal Expansion X10-6/°C 4 ~ 5
Particle Shape - Isotropic Sphere
Dielectric Constant 1MHz 9
Purtity % 98 96
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