Ceramics

Aluminum Nitride | AlN

Aluminum Nitride | AlN

Our Aluminum Nitride (AlN) materials have high thermal conductivity, high electric insulation and have a coefficient of thermal expansion similar to that of silicon (Si). It is used as a substrate for power module and LED.

Material Characteristics for Alumina Substrates (Al2O3), Zirconia Toughened Alumina Substrates (Al2O3/ZrO2), Aluminum Nitride (AlN) Substrates, and Silicon Nitride(Si3N4)

Condition Unit Al2O3 Al2O3/ZrO2 AlN Si3N4
HA-96-2 HBS ZTA AN-170 AN-200 AN-230 SN-90
Material - - 96% 96.5% Al2O3/ZrO2 AlN AlN AlN Si3N4
Color - - White White White Gray Gray Beige Gray
Bulk density - g/㎤ 3.75 3.75 4.00 3.30 3.30 3.30 3.22
Surface roughness Ra - µm 0.4 0.3 0.2 0.2 0.3 0.3 0.4
Reflectivity 0.3-0.4mmt % 70 70 80 35 - - -
0.8-1.0mmt 80 80 90 25 - - -
Mechanical Bending strength 3-point method MPa 400 500 700 450 400 350 800
Modulus of elasticity - GPa 330 330 310 320 - - 310
Vickers hardness - GPa 14 14 15 11 11 11 15
Fracture toughness IF method MPa・√m 3.0 - 3.5 3.0 2.6 2.4 6.5
Thermal Coefficient of thermal expansion 40-400°C 10-6/K 6.7 6.7 7.1 4.6 4.6 4.6 2.6
40-800°C 7.8 7.8 8.0 5.2 5.2 5.2 3.1
Thermal conductivity 25°C W/(m・K) 24 24 27 180 200 230 85
300°C 12 12 16 120 130 145 -
Specific heat 25°C J/(㎏・K) 750 750 720 720 720 720 680
Electrical Dielectric constant 1MHz - 9.8 9.8 10.2 8.5 8.5 8.5 7.8
Dielectric loss factor 1MHz 10-3 0.2 0.2 0.2 0.3 0.3 0.3 0.4
Volume resistivity 25°C Ω・㎝ >1014 >1014 >1014 >1014 >1014 >1013 >1014
Breakdown strength DC ㎸/㎜ >15 >15 >15 >15 >15 >15 >15

Characteristic Values

  • Characteristic Values
  • Characteristic Values

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