AlN Multilayered Ceramic Substrates & Packages
Features
Due to its multilayered structure, circuit designs can be delivered flexibly through layers and complex structures, e.g. cavity structures, are available.
AlN, an excellent heat disspation material, has been proven to efficiently release the heat from high heat generating IC chips.
Structure sample (cross-section)
Applications
Sensor Packages, surface-mount packages, MEMS packages, Optical communication packages, LED packages, etc
Standard specification for Multilayered Ceramic Substrate
| Item | AlN |
|---|---|
| Metallized Via | W |
| Inner layer | W |
| Surface layer | W / Cu |
| Plating | NiB / NiP-Au / NiP-Pd-Au（Electroless plating） / Ni-Au（Electrolytic plating） |
Substrate characteristics
| Item | 単位 | AlN | ||
|---|---|---|---|---|
| Color | - | Gray | ||
| Bulk density | g/㎤ | 3.30 | ||
| Mechanical characteristics | Bending strength | MPa | >350 | |
| Thermal characteristics | Coefficient of thermal expansion | ppm/℃ | 4.6 | |
| Thermal conductivity | W/(m･K) | 170 | ||
| Electrical characteristics | Dielectric constant | 1GHz | - | 8.8 |
| Volume resistivity | 100Vdc | Ω･㎝ | >1014 | |
| Breakdown strength | ㎸/100㎛ | 20 | ||
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