Thick Film Substrates & Packages (Plating)
Features
Thick film metallized substrates have been developed by combining proven ceramic materials and thick film metallization technology. Various patterning technologies allow us to support custom-made requirements. Main applications are semiconductor lasers, medical lasers and other similar products.
Applications
Submount substrate for industrial equipment and medical equipment
Standard specification for Thick Film Metallization (Plating)
| Item | Standard Specification | ||
| Substrate Material | Material | Aluminum Nitride (AlN) | Themal conductivity 170W,200W,230W |
| Thickness | 0.25～1.00mmt | - | |
| Work Size | 50.8□(2inch□),2inch×4inch□ | ||
| Film Specification | Film Composition | electrolytic plating NiAu specification：Cu / Ni / Au=20～80μm / >1μm / >0.5μm(MW recommendation） | |
| Film Thickness | Cu thickness：30～80±15μm(standard),±10μm(special） | ||
| Solder | AuSn composition：（eg）Au / Sn=75 / 25±5wt%（ratio is flexible） | ||
| AuSn thickness： 1.5μm～7μm±20% | |||
| Pattern | Accuracy L / S=100μm / 150μm(Cu thickness over 50μm),50μm / 80μm(Cu thickness 30μm target） | ||
| others | Cutting process | ±50μm( speical ±20μm) | |
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electrolytic plating NiAu specification (MW recommendation) 
In the case of electrolytic specification, an electrode wire is required for each land Thickened Au is possible. (Standard thickness about 1.5 μm
| Item | Inspection Item | Measurement Inspection Machines |
|---|---|---|
| Quality Assurance | Size | Measuring Microscope |
| Film Thickness | X-ray Fluorscence, Surface Rough Meter | |
| Resistance | Digital Multi Meter | |
| Externals | Microscope | |
| Wire Strength | Pltester |
Pattern accuracy
| Dimension position | Minimum Size |
|---|---|
| A Conducter Size | 0.100mm |
| B Pattern Interval | 0.150mm |
| C Substance Thickness - Pattern Interval | 0.050mm |
| D Pattern - Hole Interval | 0.100mm |
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