Alumina Substrates

Features

Alumina Substrates

MARUWA has produced alumina (Al2O3) substrates for over 40 years under severe quality control with carefully selected high purity ceramic materials that ensures stable quality and excellent properties.

Our alumina substrate has well-balanced properties of insulation, thermal conductivity and breaking strength. Moreover, one of the unique properties is its surface roughness. We can provide the ceramic substrate which is excellent in adhesion with a thin film and thick film metalization due to fine particles.

■Good smoothness / flatness with less porosity. Excellent in adhesion with thin film and thick film materials.
■Less variance in outline, plate thickness, slit pitch, etc.
■Minimal warpage, bending, and undulation.
■Physical and chemical properties are stable even under a hot environment.  Excellent in thermal shock resistance. High thermal conductivity and coefficient of thermal expansion similar to that of silicon.
■Superior mechanical strength. Products with higher mechanical strength are also in our lineup.
■Excellent resistance against oil and chemical.
■Excellent in insulation properties, high dielectric breakdown voltage, high surface resistivity / volume resistivity, and small dielectric constant.
■Stable breaking strength, and less variance in shape or dimensions.
■The high reflective substrate, especially suitable for optical applications such as LED, is also available.

Applications

LED packages, Substrate for chip resistors, HIC substrates for heat dissipation, Power modules, FAX substrates for thermal printer head
*Various processing is available (thin film metalization, thick film metalization, glaze, etc.)

Characteristic Values

Characteristic Values

General Dimensional Tolerances

General Dimensional Tolerances

Processing

MARUWA can also offer additional processing to meet your requirements.
We have technologies and extensive knowledges about ceramic materials and that's why high reliability of processed substrates can be provided.
 
 
Mechanical Processing
- Laser scribing
- Dicing (die cutting)
- Sandblasting
- MC processing
 
Polishing / Lapping
Item
Unit
Standard
Tolerance
mm
t±0.02
Surface roughness µm
Ra 0.03
 
Metalization
Various processing such as thin film, thick film, DBC, AMB, DPC is available.
For more information, Go to "thin film metalization" page or  contact us.
 
Glaze
For details, Please check "Glazed Substrates" page or contact us.

Product Inquiries

Back to Top