Thin Film Metallized Substrates

Features

Thin Film Metallized Substrates

Submounts have been developed by combining metallization and ceramic material technologies which MARUWA has cultivated for many years. The materials can be customized with various pattern technologies, such as wraparound metallization. This product is used in circuit substrates for optical storage, optical communication, RF application, and various other uses.

Applications

Applied circuit substrates for optical communication markets, circuit substrates for high frequency markets

Metallization General Specification

Metallization General Specification

Standard Specification

Standard Specification

Product Inquiries

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