Alumina Multilayered Ceramic Substrates & Packages (HTCC)
Features
Due to its multilayered structure, circuit designs can be delivered flexibly through layers and complex structures,
e.g. cavity structures, are available.
Structure sample (cross-section)
Applications
Sensor Packages, surface-mount packages, MEMS packages, Optical communication packages, LED packages etc
Standard specification for Multilayered Ceramic Substrate
| Item | Al2O3(92%） |
|---|---|
| Metalized VIA | W |
| Inner layer | W |
| Surface layer | W / Cu |
| Plating | NiB / NiP-Au / NiP-Pd-Au（Electroless plating） / Ni-Au（Electrolytic plating） |
Substrate characteristics
| Item | Unit | Al2O3(92%) | ||||
|---|---|---|---|---|---|---|
| Color | - | White | Brown | |||
| Bulk density | g/㎤ | 3.60 | 3.80 | |||
| Mechanical characteristics | Bending strength | MPa | >350 | >350 | ||
| Thermal characteristics | Coefficient of thermal expansion | ppm/℃ | 7.0 | 7.3 | ||
| Thermal conductivity | W/(m･K) | 16 | 15 | |||
| Electrical characteristics | Dielectric constant | 1GHz | - | 9.0 | 9.9 | |
| Volume resistivity | 100Vdc | Ω･㎝ | >1014 | >1014 | ||
| Breakdown strength | ㎸/100㎛ | >10 | >10 | |||
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