Aluminum Nitride (AlN) Filler
MARUWA aluminum nitride (AlN) filler is a thermal conductive ceramic filler developed from the technology of ceramic substrate. To fully draw the intrinsic characteristic of aluminum nitride (AlN) with high thermal conductivity and electrical insulation, only high-quality material is used for production. Our filler helps to improve characteristics at stability and heat dissipation of resin products. Applications using our aluminum nitride (AlN) filler : laminated board, thermal interface materials (TIMs) such as thermal grease, thermal pad, and encapsulant.
ANF-A Series
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Narrow distribution curve
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Isotropic shape
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High purity
ANF-S Series
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Sphere shape
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Narrow distribution curve
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High loading capacity
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High thermal conductivity (7 times higher than aluminum oxide (Al2O3))
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High electrical insulation
| Unit | A-Series | S-Series | ||||
| A-01-F | A-05-F | S-30 | S-50 | S80 | ||
| Bulk Density | g/㎤ | 0.36 | 0.66 | 1.50 | 1.65 | 1.65 |
| Thermal Conductivity | W/mK | 180 ~ 200 | ||||
| Electrical Insulation | Ω/㎝ | >1014 | ||||
| Thermal Expansion | X10-6/°C | 4 ~ 5 | ||||
| Particle Shape | - | Isotropic | Sphere | |||
| Dielectric Constant | 1MHz | 9 | ||||
| Purtity | % | 98 | 96 | |||
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