![[ LTCC ( Low Temperature Co-fired Ceramic ) ]](header_img/ltcc_header.gif) |
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[ LTCC ( Low Temperature Co-fired Ceramic ) ]
■ Features
Materialization of high-density, multi-functional products for high-frequency use
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A thick-film Ag electrode with excellent solder wettability is used. |
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Plated electrodes are used for wire bonding. |
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Alumina ceramic with excellent thermal expansion is applicable to high-reliability bare chip mounting. |
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The multilayer glass ceramic is applicable to wiring with high flexibility. |
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The high-Q substrate and 3mΩ/□ wiring resistance are applicable to high-frequency characteristics. |
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The built-in distributed parameter line is applicable to high-density mounting. |
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Various trimming patterns for parameter control substantially facilitate the mounting process. |
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■Applications
• VCO substrate
• Various high-frequency circuit modules
• Sensor package |
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■Characteristic
|
Item
|
LTCC |
unit |
|
Type
|
ML07 |
|
Dielectric Constant
|
7.5 |
@1GHz |
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f•Q
|
>3500 |
GHz |
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τf
|
0±10 |
ppm/°C |
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Density
|
2.9 |
g/cm3 |
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Thermal Expansion Coeficient
|
5.3 |
ppm/°C |
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Thermal Conductivity
|
3.6 |
W/m•K |
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Bending Strength
|
>260 |
MPa |
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Volume Resistivity
|
>1012 |
Ω•cm(100VDC) |
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Withstand Voltage
|
>2.0 |
KV/100μm |
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■Design rule
|
Item
|
LTCC |
unit |
|
Grade
|
Special |
Standard |
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Dimension
|
120×100mm Max |
| The design rules that meet the needs of market are strictly observed to offer products. |
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Tolerance
|
0.25% |
0.50% |
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Layer Thickness
|
0.10/0.12/0.15/0.18 |
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Camber
|
0.20% |
0.40% |
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Inner Electrode
|
Ag: 3mΩ/◊ |
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Surface Eletrode
|
Ag/(Cu): 3mΩ/◊ |
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Plating
|
(Ni - Au) |
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Cavity
|
Non |
Possible |
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Embedded Components
|
L, C |
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Thick Film Resistors
|
Possible |
Non |
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[ Common design rules for HTCC and LTCC ]
■Inner
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Dimensions
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Recommended
dimensions |
(MIN) |
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| (1) |
Via Diamerer |
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| (2) |
Via Land |
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| (3) |
Via to Line |
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| (4) |
Via to Via |
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| (5) |
Line Width |
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| (6) |
Via to Edge |
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| (7) |
Line to Edge |
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| (8) |
Line Spacing |
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■Surface
|
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Dimensions
|
Recommended
dimensions |
(MIN) |
|
| (1) |
Via Diamerer |
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| (2) |
Via Land |
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| (3) |
Via to Line |
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| (4) |
Via to Via |
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| (5) |
Line Width |
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| (6) |
Via to Edge |
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| (7) |
Line to Edge |
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| (8) |
Line Spacing |
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| (9) |
SMD Pad Spacing |
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| WB Pad Spacing |
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