![[ HTCC ( High Temperature Co-fired Ceramic ) ]](header_img/htcc_header.gif) |
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[ HTCC ( High Temperature Co-fired Ceramic ) ]
■ Features
Materialization of a variety of products with high reliability, high density, and multiple functions
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The plated electrode with excellent solder heat resistance is applicable to fine-pitch CSP. |
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Either an Au- or Ni-plated electrode can be selected for application to wire bonding. |
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The alumina ceramic with excellent thermal conductivity is applicable to high-reliability bare chip mounting. |
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The multilayer alumina ceramic is applicable to large-scale wiring with high flexibility. |
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The 10 mΩ/□wiring resistance and solid substrate are also applicable to the heater function. |
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The cavity structure is applicable to any desired sealing. |
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The printed resistor at the back of a substrate serves also as a heat release medium, substantially facilitating the mounting process. |
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■Applications
• Ceramic heater
• Optical/power element package
• Sensor package
• SMD package
• Hybrid IC with mixed power circuit
• Compact module replacing mother board |
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■Characteristic
|
Item
|
HTCC |
unit |
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Type
|
WHITE |
BROWN |
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Dielectric Constant
|
9.0 |
9.5 |
@1GHz |
|
f•Q
|
- |
- |
GHz |
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τf
|
- |
- |
ppm/°C |
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Density
|
3.6 |
3.8 |
g/cm3 |
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Thermal Expansion Coeficient
|
7.0 |
7.3 |
ppm/°C |
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Thermal Conductivity
|
16 |
15 |
W/m • K |
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Bending Strength
|
>350 |
>350 |
MPa |
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Volume Resistivity
|
>1012 |
>1012 |
Ω•cm(100VDC) |
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Withstand Voltage
|
>10 |
>10 |
KV/100μm |
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■Design rule
|
Item
|
HTCC |
unit |
|
Grade
|
Special |
Standard |
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Dimension
|
150mm♢ |
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The design rules that meet the needs of market are strictly observed to offer products.
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Tolerance
|
0.25% |
0.50% |
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Layer Thickness
|
0.2/0.3/0.4 |
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Camber
|
0.15% |
0.35% |
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Inner Electrode
|
W/Mo: 10mΩ/□ |
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Surface Electrode
|
W: 10mΩ/□ |
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Plating
|
Ni or Au |
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Cavity
|
Non |
Possible |
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Embedded Components
|
Non |
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Thick Film Resistors
|
Possible |
Non |
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