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![ALUMINA SUBSTRATES [ Al2O3 ]](header_img/alumina_header.gif) |
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The Alumina substrates are produced under severe quality control with carefully selected high-purity Alumina materials that ensures stable quality and excellent characteristics. |
■ Features
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Surface State |
:Good smoothness/flatness with less porosity due to fine particles. Excellent in adhesion with thick/thin film materials. |
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Dimensional Accuracy |
:Less variance in outline, plate thickness, slit pitch, etc. |
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Warp |
:Minimal warpage, bending, and undulation. |
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Thermal Characteristics |
:Physical/chemical characteristics are stable even under a hot environment. Excellent in thermal shock resistance. High thermal |
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Mechanical Characteristics |
:High mechanical strength and excellent resistance against oil and chemical. |
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Electrical Characteristics |
:Excellent in insulation properties, high dielectric breakdown voltage, high surface resistivity/volume resistivity, and small dielectric constant. |
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Breakage |
:Stable breaking strength, and less variance in shape/dimensions. |
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■Quality Characteristics
| Item |
Dimensional tolerance |
| Types of Alumina substrates |
AS970 |
HA-96-2 |
HA-996 |
| Dimensions |
inch (max)
|
5''x4''
±0.60%, NLT : ±0.05mm |
5''x7''
±0.5%~0.8%, NLT : ±0.08mm |
5''x4''
±0.60%, NLT : ±0.05mm |
| Plate thickness |
mm |
0.18~0.80
±10.0%, NLT : ±0.04mm |
0.25~1.20
±10.0%, NLT : ±0.05mm |
0.18~0.80
±10.0%, NLT : ±0.04mm |
| Warp |
mm |
>0.06/25.4
±0.24%, NLT : ±0.05mm |
0.08/25.4
±0.32% |
0.08/25.4
NLT : ±0.05min |
| Through hole |
mm |
0.18~0.80
±0.60%, NLT : ±0.05mm |
Φ0.20~
±10.0%, NLT : ±0.05mm |
Φ0.20~
±10.0%, NLT : ±0.05mm |
| Surface roughness |
μm |
0.3 |
0.3 |
0.1 |
| Glazed surface roughness |
μm |
- |
0.02 |
0.02 |
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■Characteristic values
| Item |
AS970 |
HA-96-2 |
HA-996 |
| Alumina purity |
% |
|
96.0 |
96.0 |
99.6 |
| Bulk density |
g/cm2 |
|
3.7 |
3.75 |
3.85 |
| Color |
|
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white |
white |
white |
Mechanical
characteristics |
Compressive strength |
GPa |
|
- |
- |
1.2 |
| Bending strength |
MPa |
|
320 |
330 |
400 |
Thermal
characteristics |
Coefficient of linear expansion |
×10-6/K |
25~800ºC |
7.3 |
7.7 |
8.1 |
| Thermal conductive |
W/m • K |
25ºC |
21.79 |
23.8 |
29.3 |
| 300ºC |
13.4 |
13.8 |
14.7 |
Electric
characteristics |
Dielectric constant |
|
1MHz 25ºC |
9.4 |
9.5 |
9.7 |
| Dielectric loss |
|
1MHz 25ºC |
0.0003 |
0.0003 |
0.0001 |
| Volume resistivity |
Ω • m |
25ºC |
≥1x1014 |
≥1x1013 |
≥1x1013 |
| 500ºC |
8.2x1010 |
3x107 |
8x109 |
| 700ºC |
3.5x107 |
4x106 |
1x107 |
| Dielectric breakdown voltage |
KV/mm |
AC60Hz |
14 |
14 |
18 |
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■Surface state • Photograph of Electron Microscope
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■Surface Roughness Record Chart
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COPYRIGHT 2009 MARUWA Co., Ltd. ALL RIGHT RESERVED.
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