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![ALUMINA SUBSTRATES [ Al2O3 ]](header_img/alumina_header.gif) |
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[ Laser Product ]
■Applications
Network resistor, chip resistor, thick-film hybrid IC, thin-film hybrid IC, general isolator
■Features
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Scribing line processing, drilling and cutting are available by CO2 gas laser processing. And two types of Alumina substrates of 96% and 99.6% are available. Processing of ALN substrates is also available. |
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It is suitable for trial products because the facilities such as metallic mold are not needed. (Very little initial cost and quick delivery) |
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It is suitable for highly precision items because of a high straight line degree and a high right angle degree when comparing to metallic mold items. |
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■Specification
Scribing spec
(Standard) |
Dot pitch |
110~160μm , tolerance ±20μm |
| Dot depth |
Max430μm(single) , tolerance ±50μm |
| Dot Φ |
Arourd Φ100μ |
| Pitch precision |
±50μm |
| Cutting spec |
Thickness |
Max1.2mm |
| Pitch precision |
±50μm |
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■Technology
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■Edge surface comparison after cutting
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COPYRIGHT 2009 MARUWA Co., Ltd. ALL RIGHT RESERVED.
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