Power Electronics

Zirconia Toughened Alumina Substrates

Zirconia Toughened Alumina Substrates

■Well controlled surface roughness with homogeneous and fine microstructure ■50% higher bending strength than Alumina or AlN substrates. ■20% higher thermal conductivity than alumina substrates. ■Higher optical reflectivity than alumina substrates. ■Higher electrical insulation and smaller dielectric constant than alumina substrates.

Aluminum Nitride (AlN) Substrates

Aluminum Nitride (AlN) Substrates

MARUWA has started to produce Aluminum Nitride (AlN) substrates since 1985 and has developed its performance. With both extremely high thermal conductivity (170-230W/mK) and insulating properties. MARUWA's AlN substrate can be the best solution in electronics applications where strict conditions are required, such as power modules (MOSFET, IGBT), LED packages for cooling and protecting circuits, packages and modules. ■High thermal conductivity (170-230W/mK), up to 9.5 times than that of Alumina ■Similar coefficient of thermal expansion to that of silicon (Si). This helps to achieve high reliability of Si chip and thermal heat cycling ■Higher electric insulation, and Smaller dielectric constant ■Higher mechanical strength (450MPa). ■Superior corrosion resistance against molten metal. ■Very high purity, no toxicity.

High Temperature Co-fired Substrates (HTCC)

High Temperature Co-fired Substrates (HTCC)

This product achieves a variety of products with high reliability, high density, and multifunction. It is used in ceramic heater, optical/power element package, and sensor package.

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